Thermal Analysis of Vapor Chamber Used for LED Cooling
Vapor chamber (VC), as a new type of heat pipe technology, with high thermal conductivity and good temperature uniformity, becomes one of the most promising technologies to solve the high-power LED thermal problems. In this paper, we study on the heat transfer performance of VC thermal module by using a combination of experimental and numerical simulation methods, and the influence of heat source layout (centralized and distributed layout) has been discussed to provide theoretical guidance for the arrangement of the LED chips. The results show that VC module is an effective cooling method for high-power LED.
the VC thermal module LED heat source layout
Yanxin Hu Jiepeng Huo Xuanyou Li Shuangfeng Wang
Key Lab of Heat Transfer and Energy Conservation, South China University of Technology, Guangzhou 51 Industrial Energy Conservation Center of Shandong Academy Sciences, Jinan, China Key Lab of Heat Transfer and Energy Conservation, South China University of Technology, Guangzhou 51
国际会议
4th International Symposium on Heat Transfer and Energy Conservation(第四届传热与节能国际研讨会 ISHTEC2012)
广州
英文
1-3
2012-01-06(万方平台首次上网日期,不代表论文的发表时间)