Novel Failure Isolation Techniques for Circuits Sensitive to Microprobe
Voltage measurement of test pad directly by microprobe is typical technique in circuit isolation stage of failure analysis. But in some special circuits which are sensitive to microprobe, the voltage of some test pads will change when microprobe needle touches the test pads. Hence it is necessary to develop new measurement skills to confirm test pad status instead of measuring voltage directly. This paper introduces several novel measurement methods to solve this issue and demonstrates these skills with real cases.
Failure analysis microprobe sensitive circuit
DiWei Fan Miao Wu Joe Yu Winter Wang ChunLei Wu JingLong Li Li Tian
Freescale Semiconductor (China) Limited, No.15, Xinghua Avenue, Xiqing Economic Development area, Tianjin,China
国际会议
三亚
英文
401-404
2012-01-06(万方平台首次上网日期,不代表论文的发表时间)