A Novel Data Analysis Methodology in Failure Analysis

摘要：

In Semiconductor IC failure analysis, failure localization is the most important step. However, as semiconductor circuits get more complex and devices trend to smaller dimension, failure localization becomes very difficult if failure is not caused during customer application, but by fab process. In this case, data analysis is recommended as a powerful addition to traditional failure analysis or yield analysis methods. This paper introduced a methodology of data analysis, which can build up correlation with distinctive view between several fields of data, such as electric analysis data, wafer process data. By this methodology, fail device related with fab process can be quickly localized. A real case of this methodology is presented.

关键词： Failure analysis Failure localization Data analysis Yield analysis

作者: Miao Wu Winter Wang Li Tian Chunlei Wu Diwei Fan

作者单位: Freescale Semiconductor (China) Limited, No.15, Xinghua Avenue, Xiqing Economic Development area, Ti Freescale Semiconductor (China) Limited, No.15, Xinghua Avenue, Xiqing Economic Development area, Ti

会议类型: 国际会议

会议名称: 2012 International Conference on Intelligent System Design and Engineering Applications(2012年智能系统设计与工程应用国际会议 ISDEA 2012)

会议地点: 三亚

会议语种:英文

页码: 988-991

在线出版日期: 2012-01-06（万方平台首次上网日期，不代表论文的发表时间）