Electrohydrodynamics Force Controlled Microtransfer Molding
In this study, an alternative microtransfer molding (uTM) technique is proposed to fabricate pillar arrays not only with high-aspect-ratio but also with a 3D feature, where an electrohydrodynamics (EHD) force induced wetting effect (Fig. 1) is introduced into the conventional uTM process to achieve a controllable filling property for a dielectric liquid of pre-polymer into the high-depth hole-array of a mold (Figs. 2 a and b).
Xiangming LI Jinyou SHAO Yucheng DING Hongmiao TIAN
State Key Laboratory for Manufacturing Systems Engineering, Xian Jiaotong University, Xian, Shaanxi, China, 710049
国际会议
The 1st International Conference on Optofluidics 2011(第一届国际光流体大会)
西安
英文
89-90
2011-12-11(万方平台首次上网日期,不代表论文的发表时间)