IMPROVING MANUFACTURABILITY OF BULK ACOUSTIC WAVE AND SURFACE ACOUSTIC WAVE DEVICES
Bulk acoustic wave (BAW/FBAR) or surface acoustic wave (SAW) technologies are widely used in making filters for wireless applications 1. While it is no longer a great challenge to make reactively sputtered piezoelectric aluminum nitride (A1N) films suitable for BAW applications 3or to make a standard SAW filter, there are critical devices that require tighter control of film properties in order to achieve required device performance. Independent control of A1N thickness and stress uniformity across wafer is critical for FBAR devices that require high coupling coefficient with tight distribution. Frequency control is big issue in SAW devices. Magnetic field manipulation was used to control stress uniformity across wafer to less than +/-50MPa. Frequency control of +/-0.05％ was demonstrated on temperature compensated SAW devices. A high volume production cluster tool with both deposition and trimming performed at the same time was demonstrated.
BAW FBAR SAW A1N, Trimming
Sergey Mishin
Advanced Modular Systems, Inc. Goleta, CA 93117 USA
国际会议
深圳
英文
110-112
2011-12-09（万方平台首次上网日期，不代表论文的发表时间）