SAINT-VENANT END EFFECT OF PIEZOELECTRIC-ELASTIC SANDWICH STRUCTURES WITH IMPERFECT BONDING UNDER ANTI-PLANE DEFORMATIONS

摘要：

The decay of Saint-Venant end effect for the antiplane deformation of piezoelectric-elastic sandwich structure is studied theoretically. The end of the sandwich structure is subjected to a set of selfequilibrated electro-elastic loads. The upper and lower surfaces of the sandwich structure are assumed to be traction-free and subjected to two kinds of electric boundary conditions. These electric boundary conditions are electrically short and electrically open. The characteristic equations for decay rate are derived. The numerical examples are given to show that the electric boundary conditions, volume fraction and the degree of the imperfect bonding have significant influences on the decay rate.

关键词： Saint-Venant end effects Decay rate Piezoelectric-elastic sandwich structure Anti-plane deformation Imperfect bonding

作者: YanXue JinxiLiu

作者单位: institute of Engineering Mechanics, Beijing Jiaotong University, Beijing 100044, China Department of Department of Engineering Mechanics, Shijiazhuang Tiedao University, Shjiazhuang 050043, China

会议类型: 国际会议

会议名称: The 2011 Symposium on Piezoelectricity,Acoustic Waves and Device Applications(2011年全国压电和声波理论及器件技术研讨会)

会议地点: 深圳

会议语种:英文

页码: 570-573

在线出版日期: 2011-12-09（万方平台首次上网日期，不代表论文的发表时间）