Study on Crack Tip Field of Shape Memory Alloy Board under Bending Load

摘要：

This paper focuses on the thermo-mechanical behaviors of shape memory alloy (SMA) board with a crack subjected to bending load. The stress field near the crack tip of SMA board is described according to the solution of linear elastic mechanics. The phase transformation behaviors of SMA board are formulated based on Zhou’s one-dimensional phase transformation model. The phase transformation zone equation is derived to describe the phase transformation zone near the crack tip.

关键词： Shape memory alloy board under deformation crack tip stress field

作者: Bo ZHOU Taiyue YIN Xukun LI

作者单位: College of Aerospace and Civil Engineering, Harbin Engineering University, Harbin 150001, China

会议类型: 国际会议

会议名称: 2011 International Conference on Advanced Materials and Engineering Materials(2011先进材料与工程材料国际会议 ICAMEM 2011)

会议地点: 沈阳

会议语种:英文

页码: 409-412

在线出版日期: 2011-11-22（万方平台首次上网日期，不代表论文的发表时间）