Degradation Mechanisms of Low Temperature Poly-Si Thin-Film Transistors under Circuit Applications
Device reliability of low temperature poly-Si (LTPS) thin-film transistors (TFTs) under circuit application is a key issue to be addressed for integration of TFT-based driver circuits. In this paper, degradation mechanisms of LTPS TFTs under various electrical biases are reviewed, including both DC and AC conditions. For n-type TFTs under DC stresses, either hot carrier (HC) or self-heating (SH) can be the controlling degradation mechanism. While for p-type TFTs biased in the ON or OFF-state, negative or positive bias temperature instability (NBTI or PBTI) dominates the device degradation. Under AC operation by Vg switching only, dynamic HC effect is the controlling degradation mechanism for n-type TFTs, while both NBTI and the dynamic HC mechanisms are effective for p-type TFTs. Under AC operation by Vd switching only, another dynamic HC mechanism due to non-equilibrium drain junction causes HC degradation in both n- and p- type TFTs. Under AC operation by synchronized Vg and Vd switching, device degradation is dominated by SH at low-frequencies whereas by dynamic HC at highfrequencies in n-type TFTs.
low temperature poly-Si (LTPS) thin-film transistor (TFT) hot carrier (HC) self-heating (SH) negative bias temperature instability (NBTI) positive bias temperature instability (PBTI) AC stress
Mingxiang Wang Xiaowei Lu Huaisheng Wang Meng Zhang Chunfeng Hu jie Zhou Min Xue Man Wong
Dept. of Microelectronics, Soochow University, Suzhou, China Dept. of Electronic Information, Nanjing Institute of Railway Technology, Suzhou, China Dept. of Electronic and Computer Engineering, the Hong Kong University of Science and Technology,Kow
国际会议
China Display/Asia Display 2011(2011年中国显示/亚洲显示会议)
江苏昆山
英文
62-65
2011-11-07(万方平台首次上网日期,不代表论文的发表时间)