Fabrication of quartz fiber reinforced Polysilazane Composites with Low Dielectric Constant and Loss
In present study, quartz fiber reinforced vinyl-contained polysilazane (Vi-PSN) composite has been fabricated with a resin-like method. Elementary studies on the Vi-PSN matrix show that the polymer is crosslinking at 160 ℃ by adding dicumyl peroxide (DCP). Thermal treatment (280-420℃) after crosslink enhances the thermal stability due to the formation of three dimensional structures through transamination reaction. The composites as prepared at 220℃ and thermal treatment between 280 and 420℃ possess flexural strength of 180-55 MPa and true density of 1.79-2.12g/cm-3. The flexural strength decreases with the increase of thermal-treatment temperature. Combining thermal properties and mechanical strength data, dielectric properties of composite as prepared and thermal-treated at 380℃ (S380) are compared. The results show the thermal and dielectric properties of S380 keeping with good mechanical properties are significantly improved: decomposition temperature up to 592℃ with dielectric constant of 3.1-3.2 and dielectric loss of 0.0010-0.0022.
Keywords polysilazane composite dielectric properties thermal properties mechanical properties
Zongbo Zhang Xiujun Wang Wei Liu Yongming Luo Caihong Xu
Institute of Chemistry, Chinese Academy of Sciences, Beijing 10090 Graduate School of Chinese Academ Institute of Chemistry, Chinese Academy of Sciences, Beijing 10090
国际会议
天津
英文
1-8
2011-10-26（万方平台首次上网日期，不代表论文的发表时间）