Meshim: A High-Level Performance Simulation Platform for Three- Dimensional Network-on-Chip

摘要：

Three dimensional network-on-chip (3D NoC) is motivated to achieve better performance, functionality, and packaging density compared to 2D NoC. To facilitate performance evaluation for .the design stage, an accurate and flexible environment for simulating the 3D NoC performance is necessary. In this paper, we present a complete high-level simulation platform for 3D NoC called Meshim, based on SystemC, including models for processors, meshbased communication architecture, and memory models. To demonstrate that our simulation platform is a powerful tool for 3D NoC design stage, we use our platform to explore the performance of architectures based on real applications. The simulation results show that our implemented 3D NoC architecture provides better performance than 2D NoC architecture, and this distinction becomes more obvious when the workload grows up.

关键词： high-level simulation 3D NoC design space exploration

作者: Menwang Xie Duoli Zhang Yao Li

作者单位: University of Science and Technology of China, Hefei, China Hefei University of Technology, Hefei, China

会议类型: 国际会议

会议名称: 2011 IEEE 9th International Conference on ASIC(2011年第九届IEEE国际专用集成电路大会)

会议地点: 厦门

会议语种:英文

页码: 377-380

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）