Comprehensive Electro-Thermal(ET) Analysis with Considering ET coupling

摘要：

Temperature and supply voltage directly influence IC performance and reliability. Thus electro-thermal(ET) analysis including power/ground(P/G) analysis and thermal analysis is very important in IC design. But present ET analysis is simply implemented because P/G analysis doesnt consider temperature changes and thermal analysis always assume supply voltage as a constant. On the observation that temperatures influence on leakage current (ET coupling effect) and supply voltages influence on power consumption, this work propose a novel SOR-based comprehensive ET method that iteratively solves the temperature with thermal analysis and the supply voltage with P/G analysis. In the method, the P/G analysis and thermal analysis are considered as two interactional processes rather than two independent counterparts. Experimental results show that compared with our method, present ET analysis methods will give too pessimistic or optimistic results W/O considering ET coupling effect.

关键词： P/G analysis Thermal analysis Electro-thermal coupling Supply voltage Temperature.

作者: Huang Kun Zhao Guoxing Yang Xu Luo Zuying

作者单位: College of Information Science and Technology, Beijing Normal University, Beijing 100875, China

会议类型: 国际会议

会议名称: 2011 IEEE 9th International Conference on ASIC(2011年第九届IEEE国际专用集成电路大会)

会议地点: 厦门

会议语种:英文

页码: 441-444

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）