TSV Based 3D IC Wire Length Calculation Algorithm
This paper forwards a novel wire length calculation algorithm based on TSV position. Typical 2D wire length calculation method such as half-perimeter model does not take via position into account. But in 3D IC placement, TSV position does affect the real wire length which is ignored in previous works. To get accurate wire length data and help 3D placement researches, this paper forwards the TSV based 3D IC wire length algorithm. Experiments are done on folded placement results of IBM placement benchmark circuits. Results shows that this algorithm can effectively identify the difference wire length of the cross wafer net according to the traditional method and calculate it accurately.
Ligang Hou Shu Bai Jinhui Wang
VLSI &System Lab, Beijing University of Technology, Beijing 100124, China
国际会议
2011 IEEE 9th International Conference on ASIC(2011年第九届IEEE国际专用集成电路大会)
厦门
英文
878-881
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）