The Simulation Analysis of Mobile Phone Back Cover Injection Molding Based on Moldflow
Along with the rapid development of electronic communication technology and the widely application of mobile phones, it is required to shorten the production period ,to lower production cost and to increase the competitive power. The traditional design method obviously cannot satisfy the requirement of production, but the application of Moldflow software can solve it ,which can analysis the product structure reasonably, to realize the optimization design of the parts; which can formulate rational production process parameters, such as the filling time and the holding time etc; which can analyze the warping ,bubble, lack of material common defects ,to optimize mold design; which can design the die structure, such as reasonable pouring system,to shorten the cycle of mold design ,to reduce production cost and enhance the competitiveness of enterprises.
Moldflow Injection mold Simulation
LiuLing WangLiang
Department of Mechanical Engineering An Yang Institute of Technology , An Yang
国际会议
大连
英文
282-285
2011-10-19（万方平台首次上网日期，不代表论文的发表时间）