Design of Transport Layer Assisted Routing for Thermal-Aware 3D Network-on-Chip

摘要：

The thermal challenge of 3D Network-on-Chip (NoC) is more severe than 2D NoC. To ensure thermal safety and avoid huge temperature-limited performance back-off, run-time thermal management (RTM) is required. In RTM, the regulation of temperature requires throttling of the near-overheated router, which makes the topology become Non-Stationary Irregular Mesh (NSI-mesh). To successfully deliver packet in NSI-mesh, we propose the Transport Layer Assisted Routing (TLAR) framework, the Downward-Lateral Deterministic Routing (DLDR) algorithm, and the corresponding architecture. Based on the results of experiment and implementation, the proposed routing scheme can improve throughput by 70％, and the hardware overhead is only 11.1％.

作者: Tzu-Chu Yin Chih-Hao Chao Shu-Yen Lin An-Yeu (Andy) Wu

作者单位: Graduate Institute of Electronics Engineering,National Taiwan University,Taipei

会议类型: 国际会议

会议名称: 2011亚太信号与信息处理协会年度峰会(APSIPAASC 2011)

会议地点: 西安

会议语种:英文

页码: 1-6

在线出版日期: 2011-10-18（万方平台首次上网日期，不代表论文的发表时间）