Increase Productivity in Circuit Board Manufacturing Through Support Vectors

摘要：

This paper investigates the possibility of using support vector machines (SVM) to increase productivity in manufacturing printed circuit boards. The current method of setting up a machine to place solder pastes on circuit boards is a very sophisticated and time consuming process, requiring many trial and error steps. SVMs are used to predict the outcome of a new production run based on support vectors extracted from machine setup parameters used in previous production runs. By incorporating a SVM machine in the production line, the amount of solder to be placed on a circuit board can be effectively monitored and adjusted at the early stage of the production line, resulting in much higher productivity of a SMT-based production line.

关键词： Support vectors Support vector machines Surface mount technology SMT processes

作者: Hai Tuyen Tran Chia-Jiu Wang

作者单位: Department of Electrical and Computer Engineering, University of Colorado, Colorado Springs,CO 80918, USA

会议类型: 国际会议

会议名称: The Second International Conference on Cognitive Neurodynamics--2009(第二届国际认知神经动力学会议)

会议地点: 杭州

会议语种:英文

页码: 663-670

在线出版日期: 2009-11-15（万方平台首次上网日期，不代表论文的发表时间）