Surface Texturing for Crystalline Silicon Solar Cell Using RIE Equipped with Metal-mesh
Surface texturing is an important process to enhance light absorption and to improve efficiency of a solar cell. Reactive ion etching (RIE) process is a very effective process and low-cost process, which is applicable during the dry etching processes for thin crystalline silicon solar cells with large areas. In this study, we studied a dry and free mask texturing process on crystalline silicon wafer using SF6/O2 plasmas and metal mesh in a RIE system, with special attention to the effect of the metal mesh and RIE conditions on the texture of the silicon surface. In particular, we have found an optimized RIE conditions by increasing the distance between the metal mesh and silicon wafer. We have also found that by increasing the RIE process time, with an optimized SF6/O2 ratio, pressure and RF power, it is possible to switch from a random texture, to a nm-size pyramid texture and finally to an um-size pyramid texture. This RIE system textured a crystalline wafer surface that formed about 1-2 urn pyramidal black silicon with 710% of reflectivity.
RIE Surface texturing Pyramid structure Metal mesh Solar cell
Dae-Young KONG Chan-Seob CHO Jun-Hwan JO Bong-Hwan KIM Jong-Hyun LEE
School of EECS, Kyungpook National University, Daegu, Korea 702-701 School of EE, Kyungpook National University, Sangju, Korea 742-711 Department of EE, Catholic University of Daegu, GyeongSan, Korea 780-713
国际会议
2011 International Conference on Mechatronics and Materials Processing(2011年机电一体化与材料加工国际会议 ICMMP)
广州
英文
747-750
2011-11-18(万方平台首次上网日期,不代表论文的发表时间)