Determination of Residual Stress of Hard Film/Soft Substrate Specimens via Unloading Results of Nanoindentation Tests

摘要：

A method used to determine the residual stress in a hard film deposited on a soft substrate via the unloading load-depth curves was proposed. The unloading curves with transitional behaviors were used to determine the film deflection stiffness, and then the residual stresses were obtained. Significant extra stresses were induced by a cube corner indenter at large depth. In contrast, the indentation-induced stresses could be neglected in cases of Berkovich indentation at relatively small depths.

关键词： Residual Stress Hard Film Nanoindentation

作者: HUU HUNG NGUYEN PAL JEN WEI JEN FIN LIN

作者单位: Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University,Tainan 701, Department of Mechanical Engineering, National Cheng Kung University, Tainan 701, Taiwan

会议类型: 国际会议

会议名称: 2011 International Conference on Mechatronics and Materials Processing(2011年机电一体化与材料加工国际会议 ICMMP)

会议地点: 广州

会议语种:英文

页码: 843-848

在线出版日期: 2011-11-18（万方平台首次上网日期，不代表论文的发表时间）