ABS Fabrics Chemically Plated by Cu/Ni-P as Electromagnetic Shielding Material

摘要：

In this paper, a novel composite material of Acrylonitrile-Butadlene-Styrene resin (ABS)-based fabric coated with Cu/Ni-P was prepared via chemical redox plating technique. A series of such composite materials with varying thickness of Cu and Ni-P showed remarkable electromagnetic shielding ability. With the increase of Cu thickness, the shielding effect (SE) was increased gradually, but leveled off after 1.5μm at a SE of about 70dB. Similarly, with the increase of the depth of Ni-P coats, the SE increased gradually, and leveled off after 1 .Oμm at a SE of about 45dB. The optimum ABS/Cu/Ni-P was Cu 1.5μm and Ni-P l.Oμm unilaterally. The ABS/Cu/Ni-P composite material possessed excellent shielding ability in the range of 0.001-1000MHz at a stable SE of>80dB, and it also possessed ideal shielding effect in the range of>36GHz. But in the range of 10-18GHz, the shielding effect is slightly decreased gradually to about 60dB. So the ABS/Cu/Ni-P fabric composite is an ideal candidate for electromagnetic shielding material at low and high frequency radiations.

关键词： electromagnetic shielding ABS resin fabric chemical plating Cu/Ni-P

作者: Chengda Yu Ping Li Yongfeng Wang Lei Tang

作者单位: Beijing Institute of Technology, Haidian, Beijing, 100081 Beijing Institute of Special Electromecha Beijing Institute of Technology, Haidian, Beijing, 100081 Beijing Institute of Special Electromechanical Technology, ＃1 Beiyuan Road, Chaoyang, Beijing 100012

会议类型: 国际会议

会议名称: 2011 International Conference on Mechatronics and Materials Processing(2011年机电一体化与材料加工国际会议 ICMMP)

会议地点: 广州

会议语种:英文

页码: 1086-1089

在线出版日期: 2011-11-18（万方平台首次上网日期，不代表论文的发表时间）