A Method of MEMS Package Using Local Laser Bonding

摘要：

The negative effect of the conventional laser bonding caused by high temperature has been analyzed in the Si-glass bonding process. A new method which is the combination of chip surface activated pre-bonding and laser bonding has been proposed. The method has been used for Micro Electro Mechanical System package experiment. The process is: firstly, a hydrophilic surface was formed by using a special chemical method. Secondly, Si and glass were pre-bonded at room temperature. Finally, the laser with the wavelength of 1.070 μm, spot diameter of 480 urn, power of 70 W was local heated by the laser. This method achieves lowtemperature bonding without external press. And the tensile test also shows that the strength of sample bonding reaches 2.8 MPa~ 3.2 MPa. So it not only ensures the quality of MEMS chip, but also reduces the cost of the package.

关键词： MEMS package Local laser bonding Pyrex glass

作者: Li Cheng Yixin Zhang Jiao Xu Ming Yan

作者单位: School of Electrical and Information Engineering, Jiangsu University, Zhenjiang, China

会议类型: 国际会议

会议名称: 2011 International Conference on Mechatronics and Materials Processing(2011年机电一体化与材料加工国际会议 ICMMP)

会议地点: 广州

会议语种:英文

页码: 1313-1316

在线出版日期: 2011-11-18（万方平台首次上网日期，不代表论文的发表时间）