Bond Interface Evaluation by Ultrasonic Testing and SEM for Radial Friction Welding Joints of Copper and Steel

摘要：

The bonds of T2 copper/50steel were studied by inertial radial friction welding techniques at different conditions. Ultrasonic C-scan testing was employed to evaluate the bonding situation. In order to verify the reliability of ultrasonic C-scan testing results, the optical microscope, SEM and shear test were used to analyse the microstructure and mechanical properties. It was found that ultrasonic C-scan testing was useful to evaluate the inertial radial friction welding joint situations by analyzing the ratio of good bonded area in the bond area of ultrasonic C-scan images. And the correctness of ultrasonic C-scan testing was testified by microstructure examination. Furthermore, it was concluded that enough metalline plastic deformation occurred, oxide film of joint was destroyed and constituent elements were mutually diffused sufficiently, when two stage pressure was employed and friction pressure 78 MPa, friction speed 3200r/min were used.

关键词： Radial friction welding Ultrasonic testing SEM Copper-alloy Steel

作者: Wei Wu Ling Yun Zhu Guang Feng Wu

作者单位: College of Material Science & Engineering, Chongqing University of Technology, Chongqing 400054, Chi College of Computer Science & Engineering, Chongqing University of Technology, Chongqing 400054, Chi

会议类型: 国际会议

会议名称: 2011 International Conference on Mechatronics and Materials Processing(2011年机电一体化与材料加工国际会议 ICMMP)

会议地点: 广州

会议语种:英文

页码: 1457-1461

在线出版日期: 2011-11-18（万方平台首次上网日期，不代表论文的发表时间）