Vibration Fatigue Analysis of the Solder Connector
With the increasing problems of fatigue failure of PCB in aeronautic and astronautic electronic chassis, the paper proposes a life prediction method of the solder connector based on physics of failure by simulation and physical test. The virtual modal and random vibration response of the box should be solved by finite element method in the ANSYS software, and these results have been verified by modal test and random vibration test. While the structure parameter and the environment stress of the box, the results of the simulation as the input of the vibration fatigue physics of failure model, the life of solder connector could be computed. There is a comparison between results from the CalcePWA software and it from physics of failure model and simulation.
Finite element Simulation Physics of failure Reliability prediction
Xiaoxi Guo Chuanri Li Longtao Liu
Beihang University, Beijing City, China.100191
国际会议
上海
英文
294-298
2011-10-21（万方平台首次上网日期，不代表论文的发表时间）