Study On High Thermal Conductive BN/Epoxy Resin Composites
In contemporary electronic technology era, the volume of electronic equipment and printed circuit board reduced so dramatically that the requirements of heat dissipation and insulation increase thereafter. In this research, y-aminopropyltriethoxysilane (KH550)treated boron nitride (BN) powder was used as a filler to modify epoxy composites. Effects of the BN particle size and concentration on the thermal conductivity of composites were investigated. SEM image showed the treated BN filler dispersed well in the composite matrix. Moreover, the thermal conductivity was enhanced as the BN concentration was increased. Similar phenomenon was also observed when the filler particle size was reduced. Results indicated that with increasing amount of BN addition, the composites thermal conductivity showed a nearly linear increase. When the mass fraction of BN was 30％ and its particle size was 220 nm, the thermal conductivity reached 3.4 W/(mk), which was 17 times as high as that of pure EP resin.
EP Boron nitride Thermal conductivity
Hui Wang Peng Chen Jian Sun Xiaojun Kuang Zhenkun Yao
No.333 Nanchen Road, Baoshan, Shanghai, PRC No. 158. Chanaxiana Road. Nanxiana Town. Jiadina. Shanahai. PRC
国际会议
上海
英文
1751-1754
2011-10-21（万方平台首次上网日期，不代表论文的发表时间）