Process Reliability Improvement of Microwave Module

摘要：

Process improvement of a microwave module is introduced in this paper. By orthodoxy experiment, die attach strength an bond strength were optimized, so reliability and process consistence of the batch product were ensured.

关键词： die attach strength bond strength orthodoxy experiment

作者: Ping LI Yuan CHEN

作者单位: The Fifth Research Institute of MIIT Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou, China

会议类型: 国际会议

会议名称: 2011 International Conference on Quality,Reliability,Risk,Maintenance,and Safety Engineering(2011年质量、可靠性、风险、维修性与安全性国际会议暨第二届维修工程国际学术会议 ICQR2MSE 2011)

会议地点: 西安

会议语种:英文

页码: 839-841

在线出版日期: 2011-06-17（万方平台首次上网日期，不代表论文的发表时间）