Reliability Design and Analysis of Electronic Components Based FEM Simulation Technology

摘要：

Reliability design is the technology that study measures in design process to increase reliability and reach the desired target. With the development of computer, the reliability design and analysis based on Finite Element Method (FEM) simulation technology has became an international and universal method. The paper introduced the application of FEM Simulation Technology on Reliability Design and Analysis of Electronic Components. In this paper, the thermal and vibration characteristics of electronic components were studied using FEM, for example, LED and gridded electron gun. Structural and technics design are studied to improve thermal and vibration reliability.

关键词： reliabilit design Finite Element Method junction temperature natural frequency modal analysis

作者: Fangfang SONG Fulin NIU Xiaoqi HE

作者单位: Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Chi China Electronic Product Reliability and Environmental Testing Research Institute No.110 Dongguanzhu

会议类型: 国际会议

会议名称: 2011 International Conference on Quality,Reliability,Risk,Maintenance,and Safety Engineering(2011年质量、可靠性、风险、维修性与安全性国际会议暨第二届维修工程国际学术会议 ICQR2MSE 2011)

会议地点: 西安

会议语种:英文

页码: 883-886

在线出版日期: 2011-06-17（万方平台首次上网日期，不代表论文的发表时间）