Vertical Array Milli-Pin System for Alternative Joint Technology
The application of bonded repairs to flight critical aircraft structure is typically on the basis that the structure can sustain design ultimate load in the absence of the repair. The reason for not giving structural credit to adhesively bonded repair to safetycritical structures is the lack of reliable methods to non-destructively inspect an adhesive bond to guarantee its structural integrity. Consequently, when bonded doublers are applied as reinforcement to fatigue susceptible aircraft structure, the same inspection interval is maintained, despite clear reductions in stress and associated damage growth rates. The current paper examines the possibility of combining a novel vertical array milli-pin system (VAMPS) as a new repair technique, which might be employed to enable certification of bonded repairs or replace bonded repairs altogether. Carbon-fibre reinforced polymer laminate was joined using 0.5 mm diameter steel pins with pitch being four times the pin diameter. The effective lap-shear strength and fatigue performance of the 12.5 mm overlap joints prepared using the VAMPS were compared with bonded joints of the same overlap length as well as hybrid joints combining the adhesive and VAMPS. Preliminary data indicates the VAMPS joint residual strength is comparable to the bonded joint and is resistant to fatigue where peak stresses approach 80％ of the hot/wet strength of the adhesive joint.
bonded repairs z-pins fastened joints
P. Chang A. N. Rider R. Gravina C. H. Wang
Air Vehicles Division, Defence Science and Technology Organisation, PO Box 4331,Melbourne, Victoria, Qinetiq Aerostructures Limited, Melbourne, Australia Sir Lawrence Wackett Aerospace Research Centre, RMIT University, Australia
国际会议
2011年亚太航空航天技术学术会议(APISAT 2011)
澳大利亚
英文
1-11
2011-02-28（万方平台首次上网日期，不代表论文的发表时间）