Numerical Simulation of Temperature Field in Selective Laser Sintering
The laser sintering process of multi-component powder W/Cu is simulated by ANSYS software based on the factors of radiation, convection and thermal physical parameters on temperature. The laser power and scanning velocity which are the key process parameters to affect directly in sintering molding are studied in paper. The results show that when the scanning velocity is constant, the sintering depth is rising with the increase of laser power; In addition, when the laser power is constant, the sintering depth is decreasing with the increase of scanning velocity. To select reasonable processing parameters and meet the requirements of sintering quality on the sintering depth, the parameters of laser power and scanning velocity are optimized by analyzing the sintering depth.
Selective laser sintering Numerical simulation Temperature field Sintering depth.
Jian Zhang Deying Li Jianyun Li Longzhi Zhao
Key Laboratory of Ministry of Education for Conveyance and Equipment,East China Jiaotong University, Nanchang 330013, China
国际会议
南昌
英文
474-479
2010-10-22(万方平台首次上网日期,不代表论文的发表时间)