Low Alpha Green Molding Compound Development for CMOS 90 LQFP Automotive Products

摘要：

CMOS 90 wafers have been applied to BGA (Ball Grid Array) packages for many years. However, there are not so many applications with leadframe packages. This paper introduces the use of CMOS 90 wafers for LQFP (Low profile Quad Flat Package). This package needs to meet AEC Grade 1 reliability requirements for automotive applications. Low alpha green molcling compound is required for this package tO reduce the SER(soft error rate)for electrical robusmess．The Dackage is a 64 lcad LQFP package with silver plating coated at the lcad tips．Lead tip delammation was obserred after TC(Temperature Cycle)through cross section analysis and SEM check．Pre-mold plasma with Ar/H2 was also tried，but it OOuldn’t remove the delanmnation completely. Mechanical simulation was performed and it confirmed that there are high stresses at the tips of the lcad which will greatly affect the EMC adhesion. Optimization of the molding compound using hjgh adhesion type ofcoupling agent successfully improved the compound adhesion tO the silver coating。and removed lcad tip dclamination. As a result,the CMOS 90 LQFP package achieved the AEC Grade l rcliability requirements and passed qualification for production．

作者: J.M. Liu Yuan Yuan Junhua Luo Jinzhong Yao

作者单位: Freescale Semiconductor (China) Ltd.No.15 Xinghua Avenue, Xiqing Economic Development Area, Tianjin, China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 11-15

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）