Thermal Conductivity and Microhardness of MWCNTs/Copper Nanocomposites

摘要：

The effects of dispersion states of carbon nanotubes on thermal conductivity and Micro-hardness of Multiwalled carbon nanotube (MWCNT) reinforced copper nanocomposites were investigated. The nanocomposites were fabricated in a novel method. It involves the synthesis of MWCNT-implanted copper composite spheres and the preparation of the MWCNT/copper bulk materials using vacuum hot pressing and hot rolling. The thermal conductivity of the composites with different concentration of MWCNTs were measured. Although the coefficient of thermal conductivity decreases with the increase of the MWCNT content, it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt％. Furthermore, the microhardness of the nanocomposites are much higher than that of pure copper, which is ascribed to the good dispersion of the MWCNTs in matrix.

作者: L.S. Xu X.H. Chen X.J. Liu Y. Yu Y.R. Wu

作者单位: Department of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361024, Chi College of Materials Science and Engineering, Hunan University, Chang sha 410082, China College of Materials, Xiamen University, Xiamen 361005, China Xiamen Honglu Tungsten Molybenum Industry CO.. LTD Xiamen 361021, China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 26-30

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）