Electrodeposition of Co-Ni Nanostmctures

摘要：

Co-Ni films are widely used in electronics industry for their excellent magnetic, mechanical and electrical properties. In this work, the influence of substrate type and deposition parameters on the morphologies of electroplating Co-Ni nanostructures was investigated. It was found that scallop shelllike Co-Ni depositions could be fabricated on copper wafers. The tendency to form the scallop shell-like depositions increased with increase of deposition time and current density. While on silicon wafers, scallop shell-like Co-Ni depositions could not form. Only acupuncture-like nanostructures could be fabricated on silicon wafers at a high current density.

作者: Bai Han Dongyan Ding Yanting Zhou Yanping He Yuzhao Liu Ming Li Dali Mao

作者单位: Institute of Microelectronic Materials and Technology, School of Materials Science and Engineering, Institute of Microelectroni c Materials and Technology, School of Materials Science and Engineering,

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 47-51

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）