Processing Technology of Embedded Thin-Film Resistor Materials

摘要：

It is relatively rare for us to research Embedded Thin-Film Resistor (ETFR) Materials in domestic. This paper describes the development history and present situation of the ETFR, the whole process technology is told,the urgency of domestic products is revealed, the thermal stability and microscopic characteristics of the Ni-Cr (80/20wt.％) ETFR material that we have researched are introduced, the possible development and application is also tentatively discussed.

作者: Lifei Lai Rong Sun Tao Zhao XiaoLiang Zeng ShuHui YU

作者单位: Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055 Graduate Uni Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 60-65

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）