Failure analysis of LEDs

摘要：

Light-emitting diodes (LEDS) are a strong candidate for the nest-generation general illumination applications. The reliability of LEDs is the key point for its applications, and the main challenges facing the development of high reliable LED is packaging process. In this paper, the overview of state of the art techniques in LED failure analysis is provided, and the main failure modes such as bonding defects, die attaching defects and other defects that caused by poor package process are investigated through some failure analysis cases.

作者: Lu Guoguang Yang Shaohua Lei Zhifeng

作者单位: CEPREI, Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,Guangzhou, 510610.China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 69-72

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）