Study on Thermal Conductive Adhesives for High-power LEDs Packaging

摘要：

Direct bonded copper (DBC) as heat spreader and highly thermal conductive adhesives as thermal interface materials (TIMs), the light performances of packaged high-brightness light-emitting diodes (HBLEDs) were tested. The results indicated that the light output power of LED modules increased with the thermal conductivities of TIMs. Apart from its low bulk thermal resistance, highly thermal conductive adhesive has high adhesion with adjacent substrates which resulted in low contact thermal resistance, then the optical performance and reliability of LED package can be improved.

作者: Mingxiang Chen Tianming Xu Sheng Liu C. P. Wong

作者单位: School of Mech. Sci. and Engin, Huazhong Uni. of Sci. & Tech., Wuhan 430074, China Division of MOEMS School of Mech. Sci. and Engin, Huazhong Uni. of Sci. & Tech., Wuhan 430074, China School of Mech. Sci. and Engin, Huazhong Uni. of Sci. & Tech., Wuhan 430074, China Division of MOEMS Division of MOEMS, Wuhan National Lab for Optoelectronics, Wuhan 430074, China Dept. of Mater. Sci.

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 104-108

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）