Influence of Reflow Atmosphere on SAC305 Solder Joints
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge to present electronic assembly technologies. Inert nitrogen atmosphere can both widen the process window of reflow and improve the mechanical reliability of solder joints. The focus of this study is to investigate the effect of reflow atmosphere on the reflow process and solder joint reliability of lead-free solders (SAC305). Board level reflow in various kinds of atmospheres and microstructural characterization of the solder joint were carried out to demonstrate the influence of controllable atmosphere on the reflow quality of the lead-free solder joints. The SAC305 solder joint fabricated in 1000 ppm O2 exhibited a good surface morphology and an interface with very small pores. Surface finish of the solder pad was found to have a great influence on the as-reflowed solder joints.
Yanting Zhou Dongyan Ding Bai Han Yunhong Yu Xulin Sun Henri Chevrel Hua Ying Ming Li Dali Mao
Institute of Microelectronic Materials & Technology, School of Materials Science and Engineering, Sh Air Liquide China, Shanghai 200233, China Air Liquide Laboratory, Tsukuba-shi, Japan
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
122-128
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）