The Effect of Palladium Addition to the 63Sn37Pb Solder on the Process of the CCGA Package
Ceramic Column Grid Array (CCGA) packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA packages use high-temperature solder columns instead of balls which create a greater standoff, providing a flexible interconnection with improved thermal fatigue life of the package solder joint. This paper introduced a technology featured a palladium addition to the 63Sn37Pb solder on the column-to-component pads which formed palladium-tin intermetallics that did not melt during initial the printed circuit board (PCB) assembly and added additional strength to the solder joint.
Yingzhuo Huang Pengrong Lin Yusheng Cao Quanbin Yao
Beijing MXTronics Corporation Beijing, 100076, China
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
145-148
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）