Finite Element Simulation of Thermal Properties of 40Si-Al Alloys for Electronics Packaging

摘要：

Due to lighter, stiffer and offer superior heatsinking than traditional packaging materials, Si-Al alloys have been proved as novel materials used for packaging microwave hybrid circuitry. In the current paper, finite element geometric models based on the real microstructural images of 40Si-Al are generated. Furthermore, based on Fouriers law for heat conduction and thermal expansion equation, thermal properties including the thermal conductivity and the coefficient of thermal expansion (CTE) of 40Si-Al are quantified by finite element method (FEM). By means of statistical method in conjunction with FEM results, the thermal conductivity and CTE at room temperature are calculated, respectively. The numerical simulation result agrees with the corresponding experimental result, which shows that the methodology developed in this paper is efficient in calculating thermal properties of Si-Al alloys.

关键词： 40Si-Al thermal conductivity CTE FEM

作者: Shen Wei Pu Yu-ping Zhao Peng Zhu Li-ran

作者单位: Central Iron and Steel Research Institute No.76 Xueyuan Nanlu, Haidian, Beijing, PR. China, 100081

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 149-153

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）