Low cycle creep-fatigue behaviors of Sn-4Ag/Cu solder joints

摘要：

In this study, the creep-fatigue behaviors of the Sn4Ag/Cu solder joints were investigated using in-situ tensile stage. The results reveal that the creepfatigue process is composed by the strain hardening stage, steady deforming stage and accelerating fracture stage. During the initial few cycles, the strain increases rapidly because the solder is soft. After the strain hardening becomes saturated, the strain increases linearly with increasing cycles, strain concentration occurs in the solder close to the joint interfaces and generates the initial microcracks. When the microcracks connect to form long cracks, the failure accelerates and the specimens fracture along the joint interface shortly after that. Dislocation climb is predicated to be the major creep mechanism.

作者: Q. K. Zhang Z. F. Zhang

作者单位: Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences72 Wenhua Road, Shenyang, 110016, China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 154-157

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）