The research of relationship between the void of DBC and the temperature distribution

摘要：

DBC (Direct bonding Copper) is the most common substrate of IGBT power module in recent years. The existence of voids between the copper and the ceramic is the main process defect. The temperature distribution is multiple because of the differences in the ratio and location of the voids. In this paper, the integration of the test and numerical simulation is used to research the temperature distribution of DBC with different ratios of voids and loads. The results show that the location of the voids between the copper and the ceramic influence the temperature distribution of DBC clearly.

关键词： DBC IGBT void FEM

作者: Lv Xiaofei Zheng Libing Kong Xiangdong Jin Pengyun Han Li

作者单位: Graduate School of Chinese Academy of Sciences Institute of Electrical of Chinese Academy of Science Institute of Electrical of Chinese Academy of Sciences

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 168-171

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）