IMCs growth behavior and the characterization of its size during isothermal aging
This study was concerned on the growth behavior and the size characteristics of the interfacial intermetallic compounds (IMCs) between solder and Cu substrates during isothermal aging. Through the analysis of the 3D volume, 2D area, and the thickness of the IMC, a scientific method of characterization of the IMCs thickness size was found. That is using the image analysis software to calculate areas(S) of the cross-section at the thickness direction from a certain volume IMC, find out the whole IMCs average thickness(x). In this paper, the SnAgCu/Cu specimens were aged at 150°C for 24h, 48h, 120h, 240h, 480h. The above method was used to measure the thickness at different aging time. The quantitative relationship between IMCs thickness(x) and aging time(t) can be obtained on condition of above experiment by IMCs growth curve fitting. With the increase of aging time, the grain size of the interfacial Cu6Sn5 increased and the morphology of the interfacial Cu6Sn5 was changed from scallop-like to needle-like and then to rod-like. In this study, we also use the method to measure the solder IMCs thickness from other references. It was found that the measured data was more fitting with the index growth low and the curve fit.
IMC isothermal aging lead-free solder
Yang Sijia Yang Xiaohua Li Xiaoyan
College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350002, China Instrumentation Analysis and Measurement Center, Fuzhou University, Fuzhou, 350002, China School of Materials Science and Engineering, Beijing University of Technology, Beijing, 100022,China
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
180-185
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）