Shear Strength and Interfacial Microstructures of Low-Ag SAC/Cu and SAC-Bi-Ni/Cu Solder Joints

摘要：

Recently, the development of low-Ag Sn-Ag-Cu (SAC) solders has become a new research field in electronic packaging industry because of the braze reliability and cost concerns. In this study, the shear strength and interfacial microstructures of two kinds of lowAg solder joints, SAC/Cu and SAC-Bi-Ni/Cu, were investigated. The results obtained affirmed that the addition of Ni and Bi in low-Ag SAC0705 solder improves the shear strength of the solder joints and decreases the fracture ductility of the alloy. With 3.5％ Bi and 0.1％ Ni addition, the shear strength increases from 11.09MPa to 19.51MPa. For low-Ag solder joints investigated in this research, the shear dimples mostly appear at the interface between bulk solder and interfacial IMC.

作者: Yang Liu Fenglian Sun Pengfei Zou

作者单位: Harbin University of Science and Technology 4＃ Linyuan Road, Xiangfang District, Harbin, P.R. China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 186-189

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）