A Novel Photoresist Stripper for Bumping Technology

摘要：

Both liquid film and dry film photoresists are used broadly in bumping technology. As of today, different strippers are used to remove them separately, which adds extra cost in handling different photoresist consumables in different process schemes. In this paper, a well-designed and unique stripper is introduced to address liquid film and dry film photoresist strip compatibility issue in mixed solvents system. The results indicate the stripper can remove both liquid film and dry film photoresists at the same operation temperature.Through the dissolution mechanism, the bumps and Cu substrate are well protected under different process time

作者: Libbert Peng Bing Liu Justan Sun

作者单位: Anji Microelectronics (Shanghai) Co, Ltd Suite 613-618, Building 5, No. 3000 Longdong Ave, Pudong, Shanghai, China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 190-192

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）