The Kinetics of Interfacial Interaction between Eutectic Sn9Zn Solder and Nickel Plating

摘要：

The interfacial interaction between liquid eutectic Sn9Zn solder and electroplated Ni layer was investigated in the temperatures range of 230 ~ 290°C. The interaction gives rise to various Ni-Zn intermetallic compounds, Ni5Z21 and NiZn3, and Ni-Zn solid solution layer. The evolution of these layers is temperature dependent.The thickness of the interfacial reaction layer was measured with respect to reaction temperature and reaction time. The growth behavior of the interfacial layer and the activation energy of the interaction were discussed. The reaction mechanism was found to vary with respect to reaction temperature.

作者: Yao-Ling Kuo Kwang-Lung Lin

作者单位: Department of Materials Science and Engineering National Cheng Kung University Tainan, Taiwan 70101

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 193-198

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）