A Comparison of Two Board Level Mechanical Tests-Drop Impact and Vibration Shock
Accidentally drop induced board level intercom-nects break has become one of the most important failure modes for portable electronic products. Board level drop impact test is widely used to evaluate the mechanical shock reliability of electronic assembly interconnects. In this paper, PCB responses during drop impact and vibration shock are compared using strain measurements. The loading similarities and differences of two mechanical shock tests are analyzed. The possibility and limitation of using vibration method for evaluating drop impact reliability are discussed. Results show that vibration test could be a replacement or supplement for drop test for single mode dominating situation. Vibration shock could produce similar loading amplitude and frequency to that of drop impact by adjusting to appropriate vibration parameters,. Compared with drop tests, vibration test provide better repeatability, easier operability. However, loading similarities between two methods only appear at impact locations dominated by single mode. For the locations with different modes superimposition, vibration shock cannot produce desirable loading as drop impact.
LIU Yang SUN Fenglian ZHANG Hongwu ZHOU Zhen QIN Yong
School of Materials Science and Engineering, Harbin Univ. Sci. & Tech School of Measurement-Control Technology and Communications Engineering, Harbin Univ. Sci. & Tech Li
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
199-203
2011-10-25（万方平台首次上网日期，不代表论文的发表时间）