会议专题

Synthesis and Low-temperature Sintering of Tin-doped Silver Nanoparticles

Ag nanoparticles have been widely used in electronic packaging due to their low-temperature sintering properties. It is important to lower the melting point of Ag nanoparticles to achieve a better electrical/thermal conduction and mechanical strength. In this paper, a large amount of Sn-doped Ag nanoparticles with a size less than 10 nm were synthesized and the EDS and XRD data showed that the Sn atoms entered the Ag lattice. The sintering properties of the nanoparticles baked at different temperatures was investigated by SEM and a larger coalescence was observed for the Sn-doped Ag nanoparticles compared to the pure Ag nanoparticles, indicating that Sn helped the sintering of the nanoparticles. TGA and DSC experiments were also carried out to study the sintering process in detail.

nanoparticles sintering

Yujun Zhang Hui Yu Liangliang Li

Department of Materials Science and Engineering, Key Laboratory of Advanced Materials, Tsinghua University, Beijing,100084, Peoples Republic of China

国际会议

2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

厦门

英文

209-212

2011-10-25(万方平台首次上网日期,不代表论文的发表时间)