Study on Interface of Pd-plated Cu Wire Stitch Bonding

摘要：

Cu wire is the alternative material to the Au wire in many aspects, such as better electrical and thermal conductivity, higher mechanical strength and its lower cost for the high volume manufacture. Due to the surface oxidation of the Cu wire, the Pd-plated Cu wire (Pd-Cu wire) has been adopted quickly in many fine pitch and high density package devices. Cu wire bonding has been well understood in recent years, while Pd-Cu wire is still under intense investigation. Here we present a study on the interface of the stitch bonding by TEM analysis.

作者: Xingjie Liu Techun Wang Yuqi Cong Jiaji Wang

作者单位: Department of Material Science, Fudan University, No.220, Handan Road, Shanghai, 200433, China ASE Assembly & Test (Shanghai) Limited, No.669, Guoshoujing Road, Shanghai, 201203, China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 213-219

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）