The Re-Evaluation of Mechanical Properties of Wire Bonding

摘要：

Wire bonding is the most popular interconnection technique that has been used in microelectronics packaging due to its maturity and cost effectiveness. The technology advances in the era of miniaturization and multifunction have urges the need for the smaller wire bond size to cope with the decrease of bond pad pitches. Ultimately, this will introduces al lot of technology challenges in the characterization and performance of wire bonding micromechanical properties.

作者: Azman Jalar Muhammad Nubli Zulkifli Norinsan Kamil Othman Shahrum Abdullah

作者单位: Institute of Microengineering and Nanoelectronic (IMEN) School of Applied Physics, Faculty of Science and Technology Department of Mechanical & Materials Engineering,Universiti Kebangsaan Malaysia,43600 Bangi, Selango

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 226-233

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）