Study on soldering flux used for Sn-0.7Cu welding wire

摘要：

The wettability and corrosiveness of some organic acids were tested to choose an appropriate activator. Then orthogonal design method was used to determine the proportion among the components of the activator. At last a certain amount of water-white rosin was added to further optimize the dispensation. The final soldering flux for Sn-0.7Cu welding wire caters to the demands of welding process such as good weld ability, good liquidity, less smoke, full and shiny welding spot.

作者: Cuiping Wang Jian Wang Liang Chen Yuechan Li XingjunLiu

作者单位: College of Materials, Xiamen University Xiamen, Fujian, PR. China 361005

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 246-249

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）