Characteristics of a New Non-rosin, Lead-free Solder Paste Activity System

摘要：

In this work, an activator system used for no-rosin lead-free solder paste was prepared by compounding with 5-Sulposalicylic acid dehydrate and an organic which restrains the over-quick release of the activator. The composition of the active system was studied by thermal gravimetric analysis. Additional, characterizations of the solder paste with various formula such as viscosity, wettability and shelf life have been evaluated. The solder paste performs the best wettability, the lowest residue, and improved shelf life when the weight percentage of 5Sulposalicylic acid dehydrate to activity control agent is 20 to 47 in the activity system,.

作者: Cuiping Wang Jian Wang Juan Wang Liang Chen Xingjun Liu

作者单位: College of Materials, Xiamen University Xiamen, 361005, China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 250-256

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）