会议专题

A Comparison of Copper Sulfate and Methanesulfonate Electrolytes in the Copper Plating Process for Through Silicon Via Metallization

In this study, authors studied and compared the behaviors of the additives in copper sulfate and cupric methanesulfonate electrolytes by means of electrochemical measurement method with a rotary electrode. The electrochemical parameters including exchange current density and cathodic transfer coefficient of the electrolytes were successfully determined utilizing linear sweep voltammetry. Chronoamperometry (CA) was conducted to verify the diffusion time of additives to the surface of electrodes and the corresponding diffusion constants were characterized. Copper plating of 50/200 urn TSVs was achieved with copper sulfate and cupric methanesulfonate electrolytes respectively. The plated surface morphologies were studied using Scanning Electron Microscopy (SEM).

H. L. Henry Wu S. W. Ricky Lee

EPACK Lab, Center for Advanced Microsystems Packaging, Hong Kong University of Science & Technology Clear Water Bay, Kowloon, Hong Kong

国际会议

2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

厦门

英文

291-296

2011-10-25(万方平台首次上网日期,不代表论文的发表时间)