Effect of Ti on Wettability and Interface Reaction of SnO.7Cu Lead-free Solder
The effect of adding Ti in Sn0.7Cu lead-free solder on the wettability and interfacial reaction between the solder and Cu substrate was investigated. The results show that the wettability can be improved by adding Ti in Sn0.7Cu solder, and the spreading area is increased by 5% compared with that of Sn0.7Cu solder. It is also revealed that the growth rate of the interfacial intermetallic compound (IMC) is compressed and the IMC grain size is increased during soldering reaction. With the increase of soldering time, the IMC morphology evolves gradually from scallop-shaped to serration-shaped, and the IMC which dissolves or fractures into the solder bulk is observed.
Guoqiang Wei Daojun Luo Hongyong Gao Guanghui He
South China University of Technology, Guangzhou, P. R. China The Fifth Research Institute of MIIT, Guangzhou, P.R. China South China University of Technology, Guangzhou, P. R. China The Fifth Research Institute of MIIT, G
国际会议
2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)
厦门
英文
308-312
2011-10-25(万方平台首次上网日期,不代表论文的发表时间)