Design and Fabrication of Cu-TSV Free-standing Specimen for Uniaxial Micro-tensile Test

摘要：

A novel test sample with a micro scale free-standing specimen of Cu-TSV used for uniaxial micro-tensile test is presented in this paper. Design of a deformation-buffer reticular supporting frame of the test sample effectively reduces the deformation of Cu-TSV thin film during clamping operatioa The stress resulting from electrodepositon process is minimized by fabricating Cu-TSV thin film on surface-treated titanium seed layer. The process of titanium seed layer avoids alkali corrosion and simplifies fabrication procedure compared with that of the traditional Cr/Cu seed layer. Both finite-element method (FEM) simulation and experimental results indicates the advantages of this new design. The test sample fabricated by the optimized process well coordinates with our micro-tensile system. The Youngs modulus and the ultimate tensile strength of tested Cu-TSV thin film measured by our micro-tensile system are 25.4~32.9GPa and 574~764MPa, respectively.

作者: Junyi Li Hong Wang Huiying Wang Zhengjie Zhang Ping Cheng Guifu Ding

作者单位: National Key Laboratory of Science and Technology on Nano/Micro Fabrication Technology Shanghai Jiao Tong University, Shanghai, China

会议类型: 国际会议

会议名称: 2011 International Symposium on Advanced Packaging Materials(2011年先进电子封装材料国际会议APM)

会议地点: 厦门

会议语种:英文

页码: 318-321

在线出版日期: 2011-10-25（万方平台首次上网日期，不代表论文的发表时间）